Cooling apparatus

ABSTRACT

A cooling apparatus that includes a base plate including two heat exchange units and a cover coupled to the base plate and enclosing the two heat exchange units. A recess is defined in the base plate and between the two heat exchange units. The cover and the base plate define a heat exchange chamber that includes the two heat exchange units. The cover has a first set of openings and a second set of openings, and is coupled to the base plate such that the first set of openings is above a first heat exchange unit and the second set of openings is above a second heat exchange unit. The cooling apparatus further includes a first pumping unit on the cover and over the first set of openings and a second pumping unit on the cover and over the second set of openings.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims priority under 35U.S.C. § 120 to U.S. patent application Ser. No. 16/530,665, filed onAug. 2, 2019, which is a continuation of and claims priority under 35U.S.C. § 120 to U.S. application Ser. No. 15/433,073, filed Feb. 15,2017, now U.S. Pat. No. 10,409,341, which claims the benefit of priorityunder 35 U.S.C. § 119 to U.S. Provisional Application No. 62/295,149,filed Feb. 15, 2016, the contents of each are hereby incorporated byreference in their entirety.

BACKGROUND Field

Embodiments disclosed are related to heat dissipation using fluid, andmore particularly, to a cooling apparatus device using a circulatingcooling fluid that dissipates heat generated by a computing.

Description of Related Art

With the increase of the processing speed and performance of electroniccomponents, such as central processing units (CPU), the amount of heatgenerated during operation of the electronic component increases. Theheat generation increases the temperature of the electronic componentand, if the heat cannot be dissipated effectively, reliability andperformance of the electronic component are reduced. To preventoverheating of an electronic component, typically, a water coolingapparatus is used for cooling the electronic component and, therebymaintaining normal operation of the electronic component.

Existing fluid cooling apparatuses typically include a base plate of aheat exchange chamber attached to a CPU, and the heat exchange chamberis fluidly connected to a fluid circulating pump. The pump circulatesthe fluid inside the heat exchange chamber in order to deliver the fluidat lower temperature to the heat exchange chamber. As the fluidcirculates in the heat exchange chamber, thermal energy is exchangedbetween the base plate and the fluid and, as a result, the temperatureof the base plate is reduced and the temperature of the fluid increases.However, the existing heat exchange chambers are often of complicatedstructures and this causes a reduction in the heat transfer efficiency.

Also, existing fluid cooling apparatuses cannot dissipate heat from morethan one electronic component at a time, and they occupy a relativelylarge space.

SUMMARY

Various aspects of the present disclosure provide a cooling apparatusfor dissipating heat generated by electronic components.

According to one aspect of the present disclosure, the cooling apparatusincludes a base plate configured to dissipate heat and including twoheat exchange units and a cover coupled to the base plate and enclosingthe two heat exchange units. At least one recess is defined in the baseplate and between the two heat exchange units. The cover and the baseplate define therebetween a heat exchange chamber that includes the twoheat exchange units. The cover has a first set of openings and a secondset of openings, and is coupled to the base plate such that the firstset of openings is above a first heat exchange unit and the second setof openings is above a second heat exchange unit. The cooling apparatusfurther includes a first pumping unit disposed on the cover and over thefirst set of openings and a second pumping unit disposed on the coverand over the second set of openings. Each of the first and secondpumping units circulates fluid into and out of the heat exchangechamber.

According to another aspect of the present disclosure, the coolingapparatus includes a cooling unit including a body having a verticalsurface and a horizontal surface perpendicular to the vertical surface.The vertical surface of the body has first and second openings, and thehorizontal surface has a cavity in fluid communication with the firstand second openings. The cooling apparatus further includes a heat sinkdevice disposed in the cavity and a pumping unit coupled to the coolingunit via the vertical surface and configured to circulate fluid into andout of the cooling unit.

According to another aspect of the present disclosure, a method ofoperating a cooling apparatus includes receiving fluid into a firstpumping unit and a second pumping unit via corresponding inlets of thefirst pumping unit and the second pumping unit. Each pumping unit isdisposed on a cover coupled to a base plate, the base plate includes twoheat exchange units and contains at least one recess between the twoheat exchange units, the cover is coupled to the base plate, and a heatexchange chamber is defined between the cover and the base plate andincludes the two heat exchange units. The cover contains a first set ofopenings and a second set of openings, and is coupled to the base platesuch that the first set of openings is above a first heat exchange unitand the second set of openings is above a second heat exchange unit. Afirst pumping unit is disposed over the first set of openings and asecond pumping unit is disposed over the second set of openings. Themethod further includes transferring the fluid into the heat exchangechamber via the first and second sets of openings, transferring thefluid into the first pumping unit and the second pumping unit, andoutputting the fluid from the first pumping unit and the second pumpingunit via corresponding outlets of the first pumping unit and the secondpumping unit.

According to one aspect of the present disclosure, the cooling apparatusincludes a cooling unit having a base plate configured to dissipate heatand including at least one heat exchange unit, and a cover coupled tothe base plate and enclosing the at least one heat exchange unit. Thecover has a first surface that is substantially flat and includes afirst opening and a second opening. The cooling apparatus also includesa pumping unit coupled to the cooling unit and over the first and secondopenings. The pumping unit includes a second surface that issubstantially flat and contains a third opening and a fourth opening,the pumping unit is coupled to the cooling unit via the second surfaceand the first surface of the cover such that the third opening is influid communication with the first opening and the fourth opening is influid communication with the second opening, and the pumping unit isconfigured to output a low temperature fluid to the cooling unit andreceive a high temperature fluid from the cooling unit. The coolingapparatus further includes a sealing element is disposed between thecooling unit and the pumping unit, and the sealing element surrounds thefirst, second, third, and fourth openings

BRIEF DESCRIPTION OF THE DRAWINGS

The following figures are included to illustrate certain aspects of theembodiments, and should not be viewed as exclusive embodiments. Thesubject matter disclosed is capable of considerable modifications,alterations, combinations, and equivalents in form and function, as willoccur to those skilled in the art and having the benefit of thisdisclosure.

FIG. 1A illustrates an exploded view of a cooling apparatus, accordingto disclosed embodiments.

FIG. 1B illustrates a prior art pumping unit having a flange at anopening therein.

FIG. 2A illustrates an exploded view of the cooling unit of FIG. 1A,according to disclosed embodiments.

FIG. 2B illustrates a cross-sectional view of the base plate of FIG. 2Ataken along the line 2B-2B, according to disclosed embodiments.

FIG. 3A illustrates a partially exploded view of another embodiment of adisclosed cooling apparatus.

FIG. 3B illustrates a fluid flow in the cooling apparatus of FIG. 3Aduring operation thereof, according to disclosed embodiments.

FIG. 4A illustrates a partially exploded view of yet another coolingapparatus, according to another disclosed embodiment.

FIG. 4B illustrates a fluid flow in the cooling apparatus of FIG. 4Aduring operation thereof, according to disclosed embodiments.

FIG. 5A is a perspective view of still another embodiment of a coolingapparatus.

FIGS. 5B and 5C are different perspective views of the cooling apparatusof FIG. 5A in a disassembled state.

FIG. 5D is a cross-sectional view of the cooling apparatus of FIG. 5Btaken along the line 5D-5D.

FIG. 5E is a perspective cross-sectional view of the cooling apparatusof FIG. 5B taken along the line 5D-5D.

FIGS. 5F and 5G are top and bottom perspective views illustratingfeatures of the heat sink device of the cooling apparatus of FIGS.5A-5E, according to disclosed embodiments.

DETAILED DESCRIPTION

Embodiments described herein are directed to a cooling apparatus thatcan dissipate heat generated from multiple heat generating sources andthereby increase heat transfer efficiency. Embodiments disclosed arealso directed to a cooling apparatus that occupies a reduced spacecompared to prior art cooling apparatuses.

FIG. 1A is an exploded view of a cooling apparatus 100, according toembodiments disclosed herein. As illustrated, the cooling apparatus 100includes a pumping unit 102 that is disposed on a cooling unit 104. Thepumping unit 102 includes a pump housing 108 and a casing 110 sized orotherwise configured to receive the pump housing 108 therein. Althoughnot explicitly illustrated, a pump for circulating fluid between thepumping unit 102 and the cooling unit 104 may be disposed in the pumphousing 108. The operating speed of the pumping unit 102 may be based onor otherwise related to the rotational speed of the pump. The pumphousing 108 includes inlets 146 and 148 via which the fluid enters thepumping unit 102 and an outlet 147 via which the fluid exits the pumpingunit 102. In an embodiment, the inlets 146, 148 can be used selectively,and any unused inlet may be plugged. For instance, in FIG. 1A, the inlet146 is plugged.

The fluid may be circulated between the pumping unit 102 and the coolingunit 104 via a first opening 112 and a second opening 114 defined in thepump housing 108. Briefly, during operation, fluid may enter the pumpingunit 102 via the inlets 146 and/or 148 and then flow into the coolingunit 104 via the first opening 112. The fluid may then enter the pumpingunit 102 via the second opening 114 and exit the pumping unit 102 viathe outlet 147. The first and second openings 112 and 114 are notlimited to having any particular shape, and the first and secondopenings 112 and 114 may be elongated slots, square, circular,polygonal, or of any desired shape, and may have any desired size,without departing from the scope of the disclosure.

The cooling unit 104 may include a base plate 116 and a cover 118 thatis sized or otherwise configured to receive the base plate 116. Asillustrated, the cover 118 defines a first opening 120 and a secondopening 122. The first and second openings 120 and 122 may correspond tothe openings 112 and 114 defined in the pump housing 108. In order toprovide efficient fluid transfer between the pumping unit 102 and thecooling unit 104, the first and second openings 120 and 122 may have thesame shape and size as the openings 112 and 114 defined in the pumphousing 108. Further, the opening 120 and 122 may be sized and shapedsuch that the opening 112 coincides with the opening 120, and theopening 114 coincides with the opening 122 when the pumping unit 102 ispositioned on the cooling unit 104.

Thus, as illustrated, the first and second openings 120 and 122 may beshaped as elongated slots extending parallel to each other in the topplate 11, and the first opening 120 may be longer than the secondopening 122. However, the openings 120 and 122 may be square, circular,polygonal, or of any shape and size as the openings 112 and 114, withoutdeparting from the scope of the disclosure.

A sealing element 106 (e.g., a gasket, an O-ring, a washer, and thelike) may be disposed at an interface between the pumping unit 102 andthe cooling unit 104 to prevent fluid that flows between the pumpingunit 102 and the cooling unit 104 from leaking out of the coolingapparatus 100.

FIG. 1B illustrates a prior art pumping unit 150 having a flange 155 atthe opening 152. The pumping unit 150 may be installed in the coolingunit 104 (FIG. 1A) and the flange 155 may guide the fluid from thepumping unit 150 into the cooling unit 104 via the opening 120. Theflange 155 may be shaped and sized to fit into the opening 120 when thepumping unit 102 is installed on the cooling unit 104. The flange 155may ensure a correct placement of the pumping unit 102 when installed onthe cooling unit, and thereby minimize leakage. However, due to thepresence of the flange 155, it is not possible to use the pumping unit150 with other cooling units having openings that are not sized orotherwise configured to receive the flange 155. This limits the use ofthe pumping unit 150. The pumping unit 102, according to embodimentsdisclosed herein, does not include the flange and thus may be used witha variety of cooling units. Because the flange is absent, the bottomsurface 113 of the pump housing 108 may be considered to besubstantially flat or planar. Specifically, the bottom surface 113 maybe substantially flat between the openings 112 and 114, and between theopenings 112 and 114 and the peripheral edges of the housing 108.

FIG. 2A illustrates an exploded view of the cooling unit 104, accordingto embodiments disclosed herein. As illustrated, the cover 118 includesa top plate 119 having peripheral sidewalls 121 disposed at an edgethereof. The top plate 119 may be generally rectangular or square inshape and the sidewalls 121 may be disposed along the entire peripheryof the top plate 119. The top plate 119 and the sidewalls 121 togetherdefine or otherwise enclose a space 115. As illustrated, the openings120 and 122 may be formed in a top surface 123 of the top plate 119 andthe openings 120 and 122 are in fluid communication with the space 115.The top surface 123 may also be substantially flat between the openings120 and 122, and between the openings 120 and 122 and the peripheralsidewalls 121. Referring to FIGS. 1A and 2A, the pumping unit 102 andthe cooling unit 104 are coupled to each other via two substantiallyflat surfaces 113 and 123, and the sealing element 106 disposedtherebetween and surrounding the openings 112, 114, 120, and 122. Morespecifically, the sealing element 106 may be disposed in a recess 109defined in the surface 123. When the pumping unit 102 and the coolingunit 104 are coupled to each other, the openings 112 and 120 are influid communication with each other and the openings 114 and 122 are influid communication with each other. In an example, when the pumpingunit 102 and the cooling unit 104 are coupled to each other, theopenings 112 and 120 (or more specifically, the edges thereof) coincidewith each other and the openings 114 and 122 (or more specifically, theedges thereof) coincide with each other.

The base plate 116 may include a heat exchange unit disposed on a sideof the base plate 116. In an embodiment and as illustrated, the heatexchange unit may be or include an array of a plurality of fins 124.However, in other embodiments, the heat exchange unit may be or includepins, columns, or any other structure of a desired shape and size fordissipating heat, without departing from the scope of the disclosure.Although not illustrated, an electronic component from which heat is tobe dissipated is coupled to a side of the base plate 116 opposite theside including the heat exchange unit. The base plate 116 (or at least aportion thereof) includes a thermally conductive material, such as ametal including copper, aluminum etc., or non-metal thermally conductivematerial, such as graphite etc. The fins 124 (or at least a portionthereof) may also include a thermal conductive material. In anembodiment, the fins 124 and the base plate 116 may be integrally formedas a single piece. In another embodiment, the fins 124 may be coupled tothe base plate 116 using known techniques.

Referring briefly to FIG. 2B, illustrated is a cross-sectional view ofthe base plate 116 taken along the line 2B-2B, according to embodimentsdisclosed herein. As illustrated, the fins 124 extend transversely onthe base plate 116 along the length (or width) thereof, and are arrangedparallel to each other and perpendicular to the base plate 116. However,in other embodiments, some or all of the fins 124 may be non-parallel toeach other and may be arranged on the base plate 116 at an angle lessthan 90°. The array of fins 124 may occupy a generally central portionof the base plate 116.

Returning to FIG. 2A, the base plate 116 may define recesses 117adjacent and in fluid communication with the array of fins 124 and onopposite sides thereof. As illustrated, the recesses 117 may extendperpendicular to the fins 124. The recesses 117 may collect and/or guidethe fluid along the array of fins 124.

The cooling unit 104 may also include a pad 126 that may be positionedon the base plate 116. The pad 126 may be positioned on the base plate116 between the fins 124 and the cover 118 (or more specifically, thesidewalls 121 of the cover 118) when the cover 118 is installed on thebase plate 116. The pad 126 defines a through hole 127 located centrallyin the pad 126 and a notch 129 on a side of the pad 126. The throughhole 127 is sized to receive the plurality of fins 124, and the notch129 prevents the pad 126 from obstructing the second opening 122 of thecover 118 when the cover is installed on the base plate 116. The pad 126may occupy the space between the cover 118 and the fins 124 and mayprevent leakage of fluid.

The cooling unit 104 may also include a sealing element 128, such as agasket, O-ring, washer, and the like. When the cooling unit isassembled, the sealing element 128 may be positioned around the pad 126and between the pad 126 and the cover 118 to further prevent leakage offluid.

When the cooling unit 104 is assembled by positioning the cover 118 onthe base plate 116, the array of fins 124, the pad 126, and the sealingelement 128 are received in the space 115. The top plate 119, thesidewalls 121, and the base plate 116 cooperatively define a heatexchange chamber. The cover 118 may be welded to the base plate 116 tosecure the cover 118 to the base plate 116. The welding is not limitedto any specific type of welding and the cover 118 may be welded to thebase plate 116 using any suitable type of welding, without departingfrom the scope of the disclosure. Other fastening techniques, such asriveting, screwing, press-fitting, and the like, fasteners, such asrivets, screws, nuts, bolts, etc., may be used to secure the cover 118to the base plate 116.

The base plate 116 may be positioned on the cover 118 such that thefirst opening 120 is positioned over the fins 124 (or any other heatexchange unit used). Referring to FIGS. 1A and 2A, the base plate 116may be positioned such that the fins 124 extend in a directionperpendicular to the direction in which the first opening 120 and thesecond opening 122 extend. Stated otherwise, the fins 124 extend in adirection from the first opening 120 to the second opening 122. The baseplate 116 is attached to an electronic component (e.g., a centralprocessing unit (CPU)) from which heat is to be dissipated.Specifically, and as mentioned above, the electronic component fromwhich heat is to be dissipated is attached to the bottom surface (e.g.,the surface of the base plate 116 opposite to the surface having the fin124) using a thermally conductive material (e.g., thermal grease) inorder to transfer the heat generated from the electronic component tothe base plate 116.

The base plate 116 and the cover 118 may define installation holes 130and 132, respectively, at the corners thereof. Referring to FIG. 1A,installation holes 134 may also be defined in the pump housing 108. Theinstallation holes 130, 132, and 134 may receive fasteners, such asrivets, screws, nuts, bolts, etc. to secure the pumping unit 102 to thecooling unit 104. In an example, and as illustrated in FIG. 1A, screws133 are used to secure the pumping unit 102 and the cooling unit 104together.

FIG. 3A is a partially exploded view of a cooling apparatus 300,according to embodiments disclosed herein. As illustrated, the coolingapparatus 300 may include two pumping units 102 (labelled as 102-1 and102-2) of FIG. 1A disposed on a cooling unit 302, shown in explodedview. Although two pumping units 102 are illustrated in FIG. 3A, greaterthan two pumping units 102 can be included in the cooling apparatus 300,without departing from the scope of the disclosure.

The cooling unit 302 may be similar in some respects to the cooling unit104 in FIG. 1A, and therefore may be best understood with referencethereto where like numerals designate like components not describedagain in detail. Unlike the cooling unit 104, the cooling unit 302 maybe a generally rectangular structure having the two pumping units 102disposed on it. In an example, and as illustrated, two pumping unit 102may be disposed at opposite ends of the cooling unit 302. It will beunderstood that the cooling unit 302 is not limited to having anyparticular shape and size, and the cooling unit 302 may have desiredshape and size based on, for instance, the application and the number ofpumping units 102 disposed on the cooling unit 302, without departingfrom the scope of the disclosure.

The cooling unit 302 may include a base plate 304 having two arrays offins 124 (labelled as 124-1 and 124-2) disposed at opposite endsthereof, and a cover 306 that is sized or otherwise configured toreceive the base plate 304. The cover 306 may define two sets ofopenings 120 and 122 (FIG. 1A), each at an end of the cover 306. One setof openings 120 and 122 may be located above the array of fins 124-1 andthe other set of openings 120 and 122 may be located above the array offins 124-2. Each pumping unit 102 may be positioned on the cover 306 andon a set of openings 120 and 122.

Recesses 107 may be at the two opposite ends of the base plate 304 witheach recess 107 being in fluid communication with an adjacent array offins 124-1 or 124-2. As illustrated, a recess 307 may also be defined inthe base plate 304 between the arrays of fins 124-1 and 124-2. Therecess 307 may be in fluid communication with the arrays of fins 124-1and 124-2. A separating wall or a ridge 308 may divide the recess 307into two flow channels 309-1 and 309-2 that are fluidly isolated fromeach other. As discussed below, cool fluid may be exchanged between thearrays of fins 124-1 and 124-2 via the flow channels 309-1 and 309-2during operation of the cooling apparatus 300.

The base plate 304 may have installation holes 330 at the cornersthereof. Corresponding installation holes (not illustrated) may beprovided in the pump housing 108 and the cover 306, as discussed abovewith reference to FIG. 2A. The cooling unit 302 may be secured to eachpumping unit 102 using screws 133 received in the installation holes.However, other kinds of fasteners, such as rivets, nuts, bolts, etc. mayalso be used to secure the pumping unit 102 and the cooling unit 104together. In the illustrated embodiment, the sealing element 128 and pad126 may be omitted from the cooling unit 302. However, in otherembodiments the pad 126 and the sealing element 128 may be included inthe cooling unit 302, and may be sized or otherwise configured tooperate in the cooling unit 302 without restricting the fluid flowbetween the arrays of fins 124-1 and 124-2.

FIG. 3B illustrates fluid flow in the cooling apparatus 300 duringoperation thereof, according to embodiments disclosed herein. For thesake of clarity of illustration, not all components of the coolingapparatus 300 are labelled in FIG. 3B. Each pumping unit 102 may beconnected to an individual external heat dissipating device (e.g., aradiator or similar device) or the two pumping unit 102 may share acommon external heat dissipating device. Fluid may be circulated betweenthe cooling apparatus 300 and the external heat dissipating device(s).In an example, the inlets 148 (labelled as 148-1 and 148-2) of thepumping units 102 (102-1 and 102-2) may be connected to an outlet of theexternal heat dissipating device (not expressly illustrated), and theoutlets 147 (labelled as 147-1 and 147-2) may be connected to an inletof the external heat dissipating device.

During operation, relatively cooler fluid from the external heatdissipating device may enter the pumping units 102 via the respectiveinlets 148-1 and 148-2, as indicated by the arrows A. The cooler fluidmay enter the cooling unit 302 and is exposed to the arrays of fins124-1 and 124-2, as indicated by the arrows B. Inside the cooling unit302, heat from the base plate 304 and the fins 124 is transferred to thecooler fluid and the temperature of the cooler fluid increases.

The heated fluid (or at least a portion thereof) from the array of fins124-1 flows to the array of fins 124-2 via the channel 309-1, asindicated by the arrow C1. Similarly, the heated fluid (or at least aportion thereof) from the array of fins 124-2 flows to the array of fins124-1 via the channel 309-2, as indicated by the arrow C2. By exchangingfluid between the fins 124 additional heat may be dissipated from thebase plate 304 and the fins 124, heat transfer efficiency may beincreased. The heated fluid may enter the pumping units 102, as indictedby arrows D, and may exit the corresponding pumping units 102 via theoutlets 147-1 and 147-2, as indicated by the arrows E. The heated fluidthen flows to the external heat dissipating device(s). The external heatdissipating device(s) uses a cooling device, such as a fan, to cool theheated fluid, and the cooler fluid is then provided to the inlets 148-1and 148-2 for recirculation into the cooling unit 302.

In the embodiment in FIG. 3B, the pumping units 102-1 and 102-2 arereferred to as operating in series. Such a configuration increasesthroughput and may be used for cooling relatively large size integratedcircuits (ICs) or other large heat generating devices. To ensure themost efficient operation of the cooling apparatus 300, the pumping units102-1 and 102-2 may be operated at the same operating speeds.

FIG. 4A is a partially exploded view of a cooling apparatus 400,according to another embodiment disclosed herein. The cooling apparatus400 may be similar in some respects to the cooling apparatus 300 in FIG.3A, and therefore may be best understood with reference thereto wherelike numerals designate like components not described again in detail.In the cooling apparatus 400, the base plate 304 may not include acontinuous recess between the arrays of fins 124-1 and 124-2 like therecess 307 in the cooling apparatus 300 of FIG. 3A. As illustrated, thebase plate 304 may contain two recesses 407-1 and 407-2 (collectivelyreferred to as recesses 407) that are fluidly separated from each other.In other words, fluid may not transfer between the recesses 407-1 and407-2. The recess 407-1 may reside adjacent the array of fins 124-1 andmay be in fluid communication therewith. The recess 407-2 may resideadjacent the array of fins 124-2 and may be in fluid communicationtherewith. In FIG. 4A, the recesses 407 are illustrated as having asemicircular shape. However, the recesses 407 are not limited to havingany particular shape. Further, both recesses 407 may have the same shapeor each recess 407 may have a different shape.

FIG. 4B illustrates fluid flow in the cooling apparatus 400 duringoperation thereof, according to embodiments disclosed herein. For thesake of clarity of illustration, not all components of the coolingapparatus 400 are labelled in FIG. 4B. The operation of the coolingapparatus 400 may be similar in some respects to the operation ofcooling apparatus 300 in FIG. 3B, and therefore may be best understoodwith reference thereto where like numerals designate like components notdescribed again in detail.

As illustrated in FIG. 4B, relatively cooler fluid from the externalheat dissipating device may enter the pumping units 102 via therespective inlets 148-1 and 148-2, as indicated by the arrows A. Thecooler fluid may enter the cooling unit 302 and contacts the arrays offins 124-1 and 124-2, as indicated by the arrows B. Inside the coolingunit 302, heat from the base plate 304 and the fins 124 is transferredto the cooler fluid and the temperature of the cooler fluid increases.

Unlike in the operation of the cooling apparatus 300, the heated fluidfrom the arrays of fins 124 does not mix with each other. As indicatedby arrow C1, heated fluid from the array of fins 124-1 is prevented fromflowing to the array of fins 124-2 due to the recess 407-1. Similarly,as indicated by arrow C2, the heated fluid from the array of fins 124-2is prevented from flowing to the array of fins 124-1 due to the recess407-2. The heated fluid may then enter the pumping units 102, asindicted by arrows D, and may exit the corresponding pumping units 102via the outlets 147-1 and 147-2, as indicated by the arrows E. Theheated fluid then flows to the external heat dissipating device(s) thatcool the fluid using a cooling device, such as a fan. The cooler fluidis then provided to the inlets 148-1 and 148-2 for recirculation intothe cooling unit 302.

Thus, in the cooling apparatus 400, fluid enters and exits from the samepumping unit 102. There is no exchange of fluid between the pumpingunits 102. In the embodiment in FIG. 4B, the pumping units 102-1 and102-2 are referred to as operating in parallel. In such a configuration,each pumping unit 102 may operate at a different operating speed.Because each pumping unit 102 operates individually, the configuration(e.g., flow resistance, etc.) of the heat exchange chambers of eachpumping unit 102 may be different. In an embodiment, sensors may monitorthe operating conditions of each pumping unit 102 and, may communicateinformation regarding the operating conditions of each pumping unit 102to a controller. Based on the information, the controller may vary theoperation of the pumping units 102 so that both pumping units 102 havethe same heat dissipating efficiency. For instance, the controller mayvary the operating speed of one or more pumping units 102. The coolingapparatus 400 also may be used for cooling relatively large sizeintegrated circuits (ICs) or other large heat generating devices.

FIG. 5A is a perspective view of another embodiment of a coolingapparatus 500. The cooling apparatus 500 may be similar in some respectsto the cooling apparatus 100 in FIG. 1A, and therefore may be bestunderstood with reference thereto where like numerals designate likecomponents not described again in detail. In the assembled state of thecooling apparatus 500 illustrated in FIG. 5A, the pumping unit 102 maybe vertically oriented as opposed to a horizontal orientation in thecooling apparatus 100. FIGS. 5B and 5C are different perspective viewsof the cooling apparatus 500 in a disassembled state.

Referring to FIGS. 5A-5C, the cooling apparatus 500 may include acooling unit 508 coupled to the pumping unit 102. The cooling unit 508may have a generally T-shaped body 501 having a first or “vertical”surface 513 and a second or “horizontal” surface 509 perpendicular tothe first surface 513. As illustrated in FIG. 5A, the pumping unit 102may be coupled to the cooling unit 508 via the first surface 513. Thecooling unit 508 and the pumping unit 102 are secured to each otherusing fastening techniques discussed above. The cooling unit 508 may besized or otherwise configured to receive (or alternatively provide ahousing for) a heat sink device 502 that functions as a heat sink toremove heat from an electronic component (e.g., a central processingunit (CPU)) or other heat generating sources coupled thereto. Theelectronic component or any other heat generating sources may be coupledon the surface 511 of the heat sink device 502 located generally abovethe fins 124. A heat generating source may be coupled to the surface 511using a thermally conductive material (e.g., thermal grease) in order totransfer the heat generated from the heat generating source to fins viathe base plate 516.

Referring to FIG. 5B, the cooling unit 508 contains openings 120, 122 onthe first surface 513 thereof. Referring to FIG. 5C, the pump housing108 of the pumping unit 102 has openings 112, 114 that correspond to theopenings 120, 122, similar to the cooling apparatus 100. FIG. 5D is across-sectional view of the cooling apparatus 500 taken along the line5D-5D in FIG. 5B. FIG. 5E is a perspective cross-sectional view of thecooling apparatus 500 taken along the line 5D-5D in FIG. 5B and with theheat sink device 502 removed from the cooling unit 508. Referring toFIGS. 5D and 5E, the heat sink device 502 includes a base plate 516, atop plate 518, and the array of fins 124 disposed between the base plate516 and the top plate 518. The body 501 of the cooling unit 508 maycontain a cavity 510 in the second surface 509 that is sized orotherwise configured to receive the heat sink device 502. The heat sinkdevice 502 also includes columns or pillars 512 extending from the topplate 518. The columns 512 support the heat sink device 502 bycontacting a bottom surface 515 of the cavity 510 when the heat sinkdevice 502 is installed in the cooling unit 508. When installed, body501 may function similar to a cover that encloses the fins 124 thatextend perpendicular to the first surface 513 of the cooling unit 508.Stated otherwise, the fins 124 and the openings 120, 122 may extend tobe perpendicular to each other.

The body 501 may contain a plurality of channels 520 near the openings120. The channels 520 fluidly connect the opening 120 with the cavity510. The body 501 may also contain a passage 522 extending from thecavity 510 (or more specifically, from the bottom surface 515 thereof)to the opening 122 and thereby fluidly connecting the cavity 510 to theopening 122.

Referring to FIGS. 5A-5E, the heat sink device 502 may containinstallation holes 505 and the cooling unit 508 may have installationholes 507 corresponding to the installation holes 505. The installationholes 505, 507 may receive fasteners, such as rivets, screws, nuts,bolts, etc. to secure the heat sink device 502 to the cooling unit 508.Additionally or alternatively, other fastening techniques, such asriveting, screwing, press-fitting, and the like, may be used to securethe heat sink device 502 to the cooling unit 508. As discussed abovewith reference to cooling apparatuses 100, 300, and 400, in the coolingapparatus 500, the pumping unit 102 and the cooling unit 508 may also becoupled to each other via a sealing element (similar to the sealingelement 106) disposed between the pumping unit 102 and the cooling unit508. The sealing element may be disposed in a recess 514 defined in thesurface 513. For the sake of clarity of illustration, the sealingelement is not illustrated in FIGS. 5B and 5C.

FIGS. 5F and 5G are top and bottom perspective views illustratingfeatures of the heat sink device 502, according to embodiments disclosedherein.

Referring to FIGS. 5A-5D, during operation, relatively cooler fluid fromthe external heat dissipating device (e.g., a radiator or similardevice) may enter the pumping unit 102 via the inlet 148. The coolerfluid may then enter the cooling unit 508 via the opening 120. The fluidmay flow through the channels 520 and into the cavity 510. In the cavity510, the heat from the base plate 516 and the fins 124 is transferred tothe cooler fluid and the temperature of the cooler fluid increases.

The heated fluid then flows from underneath the fins 124, through thecolumns 512, and into the passage 522. The heated fluid may then exitthe cooling unit 508 via the opening 122 and enter the pumping unit 102via the opening 114. The heated fluid then may exit the pumping unit 102via the outlet 147. The heated fluid flows to an external heatdissipating device(s) that cools the fluid using a cooling device, suchas a fan. The cooler fluid is then provided to the inlet 148 forrecirculation. The flow path of the fluid into and out of the coolingunit 508 is indicted by the arrow M in FIG. 5D. As seen, the flow pathis generally U-shaped.

The cooling apparatus 500 provides space savings that can be used in aspace restricted environment.

Therefore, embodiments disclosed herein are well adapted to attain theends and advantages mentioned as well as those that are inherenttherein. The particular embodiments disclosed above are illustrativeonly, as the embodiments disclosed may be modified and practiced indifferent but equivalent manners apparent to those skilled in the arthaving the benefit of the teachings herein. Furthermore, no limitationsare intended to the details of construction or design herein shown,other than as described in the claims below. It is therefore evidentthat the particular illustrative embodiments disclosed above may bealtered, combined, or modified and all such variations are consideredwithin the scope and spirit of the present disclosure. The embodimentsillustratively disclosed herein suitably may be practiced in the absenceof any element that is not specifically disclosed herein and/or anyoptional element disclosed herein. While compositions and methods aredescribed in terms of “comprising,” “containing,” or “including” variouscomponents or steps, the compositions and methods can also “consistessentially of” or “consist of” the various components and steps. Allnumbers and ranges disclosed above may vary by some amount. Whenever anumerical range with a lower limit and an upper limit is disclosed, anynumber and any included range falling within the range is specificallydisclosed. In particular, every range of values (of the form, “fromabout a to about b,” or, equivalently, “from approximately a to b,” or,equivalently, “from approximately a-b”) disclosed herein is to beunderstood to set forth every number and range encompassed within thebroader range of values. Also, the terms in the claims have their plain,ordinary meaning unless otherwise explicitly and clearly defined by thepatentee. Moreover, the indefinite articles “a” or “an,” as used in theclaims, are defined herein to mean one or more than one of the elementthat it introduces.

What is claimed is:
 1. A cooling apparatus, comprising: a base plateconfigured to dissipate heat and including a heat exchange unit; a covercoupled to the base plate and enclosing the heat exchange unit, thecover and the base plate defining a heat exchange chamber that includesat least a portion of the heat exchange unit, the cover having a firstsurface including a first opening and a second opening, above the heatexchange chamber; and a pumping unit disposed on the cover and over thefirst opening and the second opening, the pumping unit configured tocirculate fluid into and out of the heat exchange chamber, wherein thefirst opening includes a first elongated rectangular-shaped slot, thepumping unit includes a second surface that contains a third opening anda fourth opening, and the pumping unit is coupled to the heat exchangechamber such that the third opening is in fluid communication with thefirst opening and the fourth opening is in fluid communication with thesecond opening and a flow path of the fluid circulating between thepumping unit and the heat exchange chamber is defined in which the fluidexits the pumping unit via the third opening that is located along acenter of the second surface and enters the heat exchange chamber viathe first opening that is located along a center of the first surfaceand exits the heat exchange chamber via the second opening that islocated at an edge of the first surface and enters the pumping unit viathe fourth opening that is located at an edge of the second surface. 2.The cooling apparatus of claim 1, wherein the heat exchange unitincludes a plurality of fins, the second opening includes a secondelongated slot parallel to the first elongated slot, the first andsecond elongated slots having different lengths, and the cover iscoupled to the base plate such that the first and second elongated slotsare perpendicular to the plurality of fins.
 3. The cooling apparatus ofclaim 2, wherein the fourth opening is in fluid communication with thesecond elongated slot.
 4. The cooling apparatus of claim 1, wherein thepumping unit and the base plate are coupled together by fasteners. 5.The cooling apparatus of claim 1, further comprising a sealing elementdisposed between the cover and the pumping unit, the sealing elementsurrounds the first, second, third, and fourth openings.
 6. The coolingapparatus of claim 5, wherein the first, second, third, and fourthopenings are located surrounded entirely by the sealing element.
 7. Thecooling apparatus of claim 5, wherein the sealing element is disposed ina recess formed in the first surface of the cover.
 8. The coolingapparatus of claim 5, wherein the sealing element is separate from thecover.
 9. The cooling apparatus of claim 5, wherein the sealing elementis disposed on the cover.
 10. The cooling apparatus of claim 1, whereinthe cover is coupled to the base plate by press-fitting.
 11. The coolingapparatus of claim 1, wherein the second surface is substantially flat,and the pumping unit is coupled to the heat exchange chamber via thesecond surface and the first surface.
 12. A method of operating acooling apparatus, the method comprising: receiving fluid into a pumpingunit via corresponding inlets of the pumping unit, the pumping unitbeing disposed on a cover coupled to a base plate, wherein the baseplate includes a heat exchange unit, the cover is coupled to the baseplate and a heat exchange chamber is defined between the cover and thebase plate and includes at least a portion of the heat exchange unit,the cover having a first surface including a first opening and a secondopening, and the cover being coupled to the base plate such that thefirst and second openings are above the heat exchange chamber, a pumpingunit is disposed over the first opening and the second opening, thefirst opening includes a first elongated, rectangular-shaped slot, thepumping unit includes a second surface that contains a third opening anda fourth opening, and the pumping unit is coupled to the heat exchangechamber such that the third opening is in fluid communication with thefirst opening and the fourth opening is in fluid communication with thesecond opening and a flow path of the fluid circulating between thepumping unit and the heat exchange chamber is defined in which the fluidexits the pumping unit via the third opening that is located along acenter of the second surface and enters the heat exchange chamber viathe first opening that is located along a center of the first surfaceand exits the heat exchange chamber via the second opening that islocated at an edge of the first surface and enters the pumping unit viathe fourth opening that is located at an edge of the second surface;transferring the fluid into the heat exchange chamber via the first andsecond openings; transferring the fluid into the pumping unit; andoutputting the fluid from the pumping unit via corresponding outlets ofthe pumping unit.
 13. The method of claim 12, wherein the heat exchangeunit includes a plurality of fins, the second opening includes a secondelongated slot parallel to the first elongated slot, the first andsecond elongated slots having different lengths, and the cover iscoupled to the base plate such that the first and second elongated slotsare perpendicular to the plurality of fins.
 14. The method of claim 13,wherein the fourth opening is in fluid communication with the secondelongated slot.
 15. The method of claim 12, wherein the pumping unit andthe base plate are coupled together by fasteners.
 16. The method ofclaim 12, further comprising a sealing element disposed between thecover and the pumping unit, the sealing element surrounds the first,second, third, and fourth openings.
 17. The method of claim 16, whereinthe sealing element is separate from the cover.
 18. The method of claim16, wherein the sealing element is disposed on the cover.
 19. The methodof claim 12, wherein the cover is coupled to the base plate bypress-fitting.
 20. The method of claim 12, wherein the second surface issubstantially flat, and the pumping unit is coupled to the heat exchangechamber via the second surface and the first surface.